Global Chemical Mechanical Planarization
Market Report
2024
Delivery Includes:- Market Timeline 2019 till 2031, Market Size, Revenue/Volume Share, Forecast and CAGR, Competitor Analysis, Regional Analysis, Country Analysis, Segment Analysis, Market Trends, Drivers, Opportunities, Restraints, ESG Analysis, Porters Analysis, PESTEL Analysis, Market Attractiveness, Patent Analysis, Technological Trend, SWOT Analysis, COVID-19 Analysis, Consumer Behavior Analysis, etc.
The base year for the calculation is 2023 and 2019 to 2023 will be historical period. The year 2024 will be estimated one while the forecasted data will be from year 2025 to 2031. When we deliver the report that time we updated report data till the purchase date.
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• The global Chemical mechanical Planarizations market will expand significantly by XX% CAGR between 2024 and 2031.
• Asia Pacific held the major market of more than XX% of the global revenue with a market size of USD XX million in 2024 and will grow at a compound annual growth rate (CAGR) of XX% from 2024 to 2031.
• Europe accounted for a share of over XX% of the global market size of USD XX million.
• North America held a market of around XX% of the global revenue with a market size of USD XX million in 2024 and will grow at a compound annual growth rate (CAGR) of XX% from 2024 to 2031.
• Latin America's market will have more than XX% of the global revenue with a market size of USD XX million in 2024 and will grow at a compound annual growth rate (CAGR) of XX% from 2024 to 2031.
• Middle East and Africa held the major market of around XX% of the global revenue with a market size of USD XX million in 2024 and will grow at a compound annual growth rate (CAGR) of XX% from 2024 to 2031.
• According to Cognitive Market Research, Polishing and Grinding equipment is the dominant equipment segment
• According to Cognitive Market Research Slurry consumables dominate the consumables segment for Chemical mechanical Planarization
• According to Cognitive Market Research Integrated circuits dominate the application segment for Chemical Mechanical Planarization
Base Year | 2023 |
Historical Data Time Period | 2019-2023 |
Forecast Period | 2024-2031 |
Global Market Size | 121212 |
Country Market Size | 121212 |
North Americ Market Size | 121212 |
Europe Market Size | 121212 |
Asia Pacific Market Size | 121212 |
South America Market Size | 121212 |
Middle East and Africa Market Size | 121212 |
Market Split by Equipment Type |
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Market Split by Consumables |
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List of Competitors |
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Regional Analysis |
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Country Analysis |
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Key Qualitative Information Covered |
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Chemical Mechanical Planarization Market is Segmented as below. Particular segment of your interest can be provided without any additional cost. Download the Sample Pages!
The market for Chemical mechanical Planarization materials is estimated to reach a valuation of USD XX million globally by 2027, with a compound yearly growth rate (CAGR) of XX% anticipated during the forecast period. A key component of the semiconductor manufacturing industry, the Chemical Mechanical Planarization (CMP) market is responsible for producing high-quality semiconductor wafers that are necessary for a wide range of contemporary electronic gadgets. Planarizing, or smoothing, surfaces precisely is made possible by CMP, a complex process that combines chemical and mechanical forces. This ensures the integrity and uniformity of semiconductor substrates. The need for CMP technologies has increased as the semiconductor industry keeps moving rapidly toward smaller, quicker, and more sophisticated chips. The highest level of precision in surface planarization and material removal is required due to the strict requirements for device performance and yield. In this endeavor, CMP is essential because it helps semiconductor producers meet the high requirements required by today's semiconductor devices.
The demand for sophisticated semiconductor manufacturing methods is being further fueled by the production of applications like as data centers, smartphones, Internet of Things devices, and automotive electronics. This is driving the growth of the CMP market. These varied applications—which range from ultra-low power consumption to high-performance computing—call for semiconductors with a wide range of parameters, all of which depend on CMP for the accurate production of semiconductor wafers. Thus, CMP is well-positioned to continue influencing the direction of semiconductor production as companies work to satisfy the changing needs of the digital age and enable the creation of cutting-edge electronics that power the globalized society.
The increasing need for cutting-edge semiconductor devices is a major factor driving the chemical mechanical planarization (CMP) market. As CMP offers an accurate technique for planarizing or smoothing surfaces—a necessary step in producing high-quality semiconductor wafers—it plays a crucial role in the semiconductor manufacturing process. The need for CMP techniques grows as the semiconductor industry develops quicker, thinner, and more sophisticated chips in order to meet the increasingly demanding specifications for device performance and yield. In addition, the demand for sophisticated semiconductor manufacturing methods is further fueled by the production of applications like as data centers, smartphones, Internet of Things devices, and automotive electronics, which in turn propels the growth of the CMP market. For instance, in March 2024, The Semiconductor Industry Association (SIA) praised the US Department of Commerce and Intel Corporation for introducing semiconductor manufacturing incentives as part of the CHIPS and Science Act. The incentives will support four Intel manufacturing projects in Arizona, Ohio, Oregon, and New Mexico. The CHIPS Act aims to incentivize companies in the semiconductor ecosystem to build, grow, hire, and innovate in the US, creating jobs and supporting hundreds of thousands of additional jobs throughout the economy.
(Source:https://www.semiconductors.org/sia-applauds-chips-act-incentives-for-intel-projects/)
Furthermore, advanced packaging technologies like 2.5D and 3D integration are in high demand and are expanding quickly. Higher degrees of integration, better performance, and smaller form factors for semiconductor devices are made possible by these packaging approaches. For instance, in August 2020, Samsung Electronics, a world leader in advanced semiconductor technology, today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today’s most advanced process nodes. Leveraging Samsung’s through-silicon via (TSV) technology, X-Cube enables significant leaps in speed and power efficiency to help address the rigorous performance demands of next-generation applications including 5G, artificial intelligence, high-performance computing, as well as mobile and wearable.
(Source:https://news.samsung.com/medialibrary/global/photo/48809/search/samsung%20electronics?&page=85#:~:text=Samsung%20Electronics%2C%20a%20world%20leader,today's%20most%20advanced%20process%20nodes.)
Manufacturers are working hard to fulfil the high demand for integrated chips in the IT and telecommunications industries, but it can be difficult to keep up with the ever-changing industry. CMP slurry vendors are trying to balance supply chain distribution in the face of growing demand from the semiconductor sector. Furthermore, CMP slurry makers' inventory is limited since component shelf life ranges between 6 and 12 months, limiting output. Thus, increased demand and restricted production have produced a market gap, resulting in an increase in the overall cost of the product. Because of the high overall demand in the semiconductor sector, operators have been investing on alternatives to CMP.
There is an increasing need for creative CMP solutions that can keep up with the changing demands of device manufacture as semiconductor technology develops. In order to achieve the precise planarization needed for modern semiconductor nodes to have smaller feature sizes and higher transistor density, CMP is essential. CMP methods must advance to meet the difficulties in planarizing ultra-thin films and numerous material layers as semiconductor makers strive for smaller process nodes. This will allow node scaling and performance enhancements to continue. In addition, Semiconductor manufacturers can get over the technological obstacles related to advanced node scaling by utilizing CMP breakthroughs such as improved process control approaches, sophisticated polishing pads, and new slurry formulas. These developments spur innovation in a number of industries by making it possible to produce semiconductor devices with improved functionality, reduced power consumption, and higher performance. For instance, in 2023, Researchers from Khalifa University, along with others from New York University Abu Dhabi, the University of Nova Gorica, the University of Maribor, the American University of Beirut, and Instituto de Ciencia de Materiales de Madrid, have developed a new type of semiconductor for organic optoelectronic devices. The n-type semiconducting conjugated microporous polymer (CMP) incorporates an Isoindigo (II) acceptor unit, a molecule used in organic photovoltaics. The team achieved the desired donor and acceptor combination using a plasma-assisted technique, surpassing previously known CMPs. (Source:https://www.ku.ac.ae/development-of-new-n-type-semiconductor-for-advanced-electronic-applications).
Furthermore, CMP is positioned as a flexible solution for upcoming semiconductor manufacturing issues due to its capacity to planarize a variety of materials, including conventional silicon substrates as well as novel materials like compound semiconductors and 2D materials. CMP technology will be essential in facilitating the integration and manufacture of these cutting-edge semiconductor devices as novel materials and device architectures are investigated for uses including artificial intelligence, the Internet of Things, automotive electronics, and 5G connectivity. Thus, the ongoing evolution of technological advancement in semiconductors will further create opportunities for the Chemical mechanical planarization market
The market for Chemical Mechanical Planarization (CMP) was greatly influenced by the COVID-19 epidemic, both directly and indirectly. The interruption of international supply chains was one of the main consequences. Raw materials, components, and equipment essential to the production of CMP were in low supply due to trade restrictions, plant closures, and transit difficulties. This hampered semiconductor manufacturers' ability to produce their goods by causing shipments to be delayed and lead times for CMP equipment and consumables to increase. In addition, lockdowns and economic uncertainty initially caused a fall in demand for consumer electronics, automobile electronics, and other end-user products using semiconductors. As a result, the manufacturing of semiconductors was reduced by manufacturers, which had an impact on orders for devices that needed CMP procedures. For instance, in December 2021, The COVID-19 pandemic led to a semiconductor shortage in the automotive and electronics industries, causing a V-shaped recovery for personal computers, mobile devices, automobiles, and wireless communications. Automakers, such as General Motors, Ford, and Stellantis, experienced shortages in sourcing semiconductor chips, resulting in 672,000 fewer light-duty vehicles produced globally. The shift to electric vehicles is increasing the need for chips, and lead times for semiconductors have worsened, with 8-inch wafer lead times increasing to 3-4 months in spring 2021.
(Source:https://www.air-worldwide.com/blog/posts/2021/12/pandemic-supply-chain-issues-semiconductors/)
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The existence of technology-driven enterprises that prioritize product offering differentiation has resulted in a highly fragmented Chemical mechanical Planarization market. Businesses are also concentrating on gaining core skills associated with a range of service offerings through a variety of strategies, such as vertical integration along the value chain, strategic alliances, and mergers and acquisitions. The major firms have resorted to capacity expansion and acquisitions as means of meeting the growing demand in the regional marketplaces. Chemical mechanical Planarization power devices have been used more often in automotive, electronics, and renewable energy systems in recent years. This trend is expected to continue in the years to come. For instance, in 2022, To speed the development of the world's most powerful computer processors, Applied Materials Inc. deployed new "cold field emission" technology. The novel technique improves nanoscale image resolution by up to 50% and imaging speed by up to 10X while operating at room temperature. CFE eBeam technology enables leading chip makers to swiftly develop and sell novel 3D Gate-All-Around logic transistors, as well as next-generation DRAM and NAND memory devices.
(Source:https://www.appliedmaterials.com/us/en/blog/blog-posts/separating-the-signal-from-the-noise--combining-advanced-imaging.html#:~:text=Applied%20Materials%20is%20the%20leading,nanometer%2Dscale%2C%20buried%20defects.)
Top Companies Market Share in Chemical Mechanical Planarization Industry: (In no particular order of Rank)
If any Company(ies) of your interest has/have not been disclosed in the above list then please let us know the same so that we will check the data availability in our database and provide you the confirmation or include it in the final deliverables.
According to Cognitive Market Research, Asia-Pacific held a significant market share of XX% in the forecast period. With top semiconductor foundries, integrated device makers (IDMs), equipment suppliers, and material suppliers, Asia Pacific has a strong and dynamic semiconductor manufacturing ecosystem. Taiwan, South Korea, Japan, and China, with their sophisticated fabrication facilities and deep knowledge of CMP technology, have become major global centers for semiconductor manufacture. In addition, Asia Pacific's significant emphasis on technological innovation and investment is one of the main factors contributing to its supremacy in the CMP industry. Semiconductor manufacturing has been elevated to a strategic economic priority by regional governments and industry partners, who also want to create an environment that supports R&D and technical growth. Asia Pacific is now at the forefront of semiconductor technology because of its dedication to innovation, which is fueling demand for CMP equipment and procedures. Furthermore, the need for advanced semiconductor devices is driven by the expanding consumer electronics market in Asia Pacific, which is driven by increased disposable incomes, urbanization, and technological adoption. Asia Pacific is a huge and dynamic market for semiconductor products, ranging from smartphones and tablets to automotive electronics and Internet of Things devices. This has encouraged investments in CMP technology to satisfy the changing needs of customers.
The current report Scope analyzes Chemical Mechanical Planarization Market on 5 major region Split (In case you wish to acquire a specific region edition (more granular data) or any country Edition data then please write us on info@cognitivemarketresearch.com
The above graph is for illustrative purposes only.
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Global Chemical Mechanical Planarization Market Report 2024 Edition talks about crucial market insights with the help of segments and sub-segments analysis. In this section, we reveal an in-depth analysis of the key factors influencing Chemical Mechanical Planarization Industry growth. Chemical Mechanical Planarization market has been segmented with the help of its Equipment Type, Consumables , and others. Chemical Mechanical Planarization market analysis helps to understand key industry segments, and their global, regional, and country-level insights. Furthermore, this analysis also provides information pertaining to segments that are going to be most lucrative in the near future and their expected growth rate and future market opportunities. The report also provides detailed insights into factors responsible for the positive or negative growth of each industry segment.
According to Cognitive Market Research, based on equipment, the market is bifurcated into Polishing & Grinding Equipment, Slurry Testing Equipment, On-Line, Laboratory, and Others. The polishing & Grinding Equipment segment dominates the largest market share of XX% during the forecast period. To ensure uniformity and consistency across semiconductor wafers, these equipment precisely manage factors including pressure, speed, slurry composition, and temperature through the use of complex mechanisms and innovative technology. In addition, the constant need for smaller, faster, and more complicated chips by the semiconductor industry emphasizes the need for polishing and grinding tools. Furthermore, the need for sophisticated polishing and grinding equipment is driven by the growing uses of semiconductor devices across a variety of industries, including data centers, automobile electronics, smartphones, and Internet of Things devices. These applications, which range from low-power consumption to high-performance computing, require semiconductors with different specifications, all of which depend on CMP operations made possible by polishing and grinding tools.
For instance, in December 2022, JTEKT introduced a new double-disc horizontal grinder, the DXSG320, which can simultaneously grind both sides of silicon wafers to +/- 1 micron from as-sliced condition. This machine design significantly improves accuracy and productivity over single-spindle vertical grinders in the chip industry. The machine is 20% (Source:https://www.geartechnology.com/articles/30139-jtekt-introduces-new-high-productivity-silicon-wafer-disc-grinder)
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According to Cognitive Market Research, based on consumables, the market is divided into Slurry, Pad, Pad Conditioners, and others. The slurry consumables segment dominated the market, accounting for around XX% of global revenue because it is an essential mechanical medium that removes irrelevant material and achieves the appropriate surface smoothness, allowing semiconductor wafers to be polished and planarized. Slurry, which is made up of additives, chemicals, and abrasive particles dispersed in a carrier fluid, is designed to maximize surface polish, defect control, and material removal rates in order to produce semiconductor wafers of the highest caliber. In Addition, Slurry is crucial to CMP procedures because of the semiconductor industry's unwavering drive for smaller feature sizes, more complicated devices, and higher performance levels. Slurry formulations are continuously improved and customized to satisfy the changing needs of advanced node scaling and device shrinking, as semiconductor manufacturers work to attain submicron-level accuracy and tolerances. The dominance of slurry in the CMP industry is anticipated to continue, stimulating innovation and influencing the direction of semiconductor manufacturing as manufacturers push the frontiers of technology and aim for more efficiency and performance.
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Senior Research Analyst at Cognitive Market Research
ResearchGate Profile: https://www.researchgate.net/profile/Kalyani-Raje
An optimistic Senior Research Analyst with years of experience in competitive assessment and business consulting. A seasoned professional and subject-matter expert (SME) in the Automobile and transportation vertical.
With a work experience of over 10+ years in the market research and strategy development. I have worked with diverse industries, including FMCG, IT, Telecom, Automotive, Electronics and many others. I also work closely with other departments such as sales, product development, and marketing to understand customer needs and preferences, and develop strategies to meet those needs.
I am committed to staying ahead in the rapidly evolving field of research and analysis. This involves regularly attending conferences, participating in webinars, and pursuing additional certifications to enhance my skill set. I played a crucial role in conducting market research and competitive analysis. I have a proven track record of distilling complex datasets into clear, concise reports that have guided key business initiatives. Collaborating closely with multidisciplinary teams, I contributed to the development of innovative solutions grounded in thorough research and analysis.
Our study will explain complete manufacturing process along with major raw materials required to manufacture end-product. This report helps to make effective decisions determining product position and will assist you to understand opportunities and threats around the globe.
The Global Chemical Mechanical Planarization Market is witnessing significant growth in the near future.
In 2023, the Polishing & Grinding Equipment segment accounted for noticeable share of global Chemical Mechanical Planarization Market and is projected to experience significant growth in the near future.
The Slurry segment is expected to expand at the significant CAGR retaining position throughout the forecast period.
Some of the key companies • Applied Materials, • Ebara Corporation and others are focusing on its strategy building model to strengthen its product portfolio and expand its business in the global market.
Please note, we have not disclose, all the sources consulted/referred during a market study due to confidentiality and paid service concern. However, rest assured that upon purchasing the service or paid report version, we will release the comprehensive list of sources along with the complete report and we also provide the data support where you can intract with the team of analysts who worked on the report.
Disclaimer:
Equipment Type | Polishing & Grinding Equipment, Slurry Testing Equipment, On-Line, Laboratory, and Others. |
Consumables | Slurry, Pad, Pad Conditioners, and others. |
List of Competitors | • Applied Materials, Inc., • Ebara Corporation, • LAM Research Corporation, • Lapmaster Wolters GmbH, • Strasbaugh Inc., • Air Products & Chemicals, Inc., • Solai Corporation, • Cabot Microelectronics Corporation, • DowDuPont, • BASF SE, • E. I. du Pont de Nemours and Company, • Shin-Etsu Chemical Co. Ltd., • TEL Corporation, • Air Products and Chemicals Inc., • Merck KGaA, • Entegris Inc., • Fujimi Incorporated, • Hitachi Chemical Company, Ltd., • Okamoto Machine Tool Works, Ltd. |
This chapter will help you gain GLOBAL Market Analysis of Chemical Mechanical Planarization. Further deep in this chapter, you will be able to review Global Chemical Mechanical Planarization Market Split by various segments and Geographical Split.
Chapter 1 Global Market Analysis
Global Market has been segmented on the basis 5 major regions such as North America, Europe, Asia-Pacific, Middle East & Africa, and Latin America.
You can purchase only the Executive Summary of Global Market (2019 vs 2024 vs 2031)
Global Market Dynamics, Trends, Drivers, Restraints, Opportunities, Only Pointers will be deliverable
Chapter 2 North America Market Analysis
Chapter 3 Europe Market Analysis
Chapter 4 Asia Pacific Market Analysis
Chapter 5 South America Market Analysis
Chapter 6 Middle East and Africa Market Analysis
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Chapter 7 Top 10 Countries Analysis (Only Available with Corporate User License)
Competitor's Market Share and Revenue (Subject to Data Availability for Private Players)
Chapter 8 Competitor Analysis (Subject to Data Availability (Private Players))
(Subject to Data Availability (Private Players))
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Data Subject to Availability as we consider Top competitors and their market share will be delivered.
Chapter 9 Qualitative Analysis (Subject to Data Availability)
Segmentation Equipment Type Analysis 2019 -2031, will provide market size split by Equipment Type. This Information is provided at Global Level, Regional Level and Top Countries Level The report with the segmentation perspective mentioned under this chapters will be delivered to you On Demand. So please let us know if you would like to receive this additional data as well. No additional cost will be applicable for the same.
Chapter 10 Market Split by Equipment Type Analysis 2019 -2031
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Chapter 11 Market Split by Consumables Analysis 2019 -2031
This chapter helps you understand the Key Takeaways and Analyst Point of View of the global Chemical Mechanical Planarization market
Chapter 12 Research Findings
Here the analyst will summarize the content of entire report and will share his view point on the current industry scenario and how the market is expected to perform in the near future. The points shared by the analyst are based on his/her detailed in-depth understanding of the market during the course of this report study. You will be provided exclusive rights to interact with the concerned analyst for unlimited time pre purchase as well as post purchase of the report.
Why Polishing & Grinding Equipment have a significant impact on Chemical Mechanical Planarization market? |
What are the key factors affecting the Polishing & Grinding Equipment and Slurry Testing Equipment of Chemical Mechanical Planarization Market? |
What is the CAGR/Growth Rate of Slurry during the forecast period? |
By type, which segment accounted for largest share of the global Chemical Mechanical Planarization Market? |
Which region is expected to dominate the global Chemical Mechanical Planarization Market within the forecast period? |
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