Advanced Semiconductor Packaging Market Report 2024 (Global Edition)

Global Advanced Semiconductor Packaging Market Report 2024 Market Size Split by Packaging Type (Fan-out Wafer-Level Packaging, Fan-in Wafer-Level Packaging, Flip Chip, 2.5 3D), by Application (Process...

Advanced Semiconductor Packaging Market Report Description

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Advanced Semiconductor Packaging Market Insights Video

Competitive Landscape of the Advanced Semiconductor Packaging Market

The competitive landscape of the Advanced Semiconductor Packaging Market features key players such as ASE Group, Amkor Technology, and TSMC, who dominate due to their extensive expertise and advanced packaging technologies like fan-out wafer-level packaging and 3D stacking. These companies invest heavily in research and development to enhance performance, reduce size, and improve power efficiency in semiconductor devices. Emerging players focus on niche packaging solutions, while collaborations with foundries, material suppliers, and equipment manufacturers are crucial for staying competitive. The market is characterized by innovation, strategic partnerships, mergers, and acquisitions to meet growing demand from electronics, automotive, and AI industries.

In November 2023, Amkor Technology announced investing US$ 2.0 Bn to build a new advanced semiconductor packaging and test facility in Arizona, U.S., to package and test chips produced at a nearby TSMC facility for Apple, Inc. (Source: https://amkor.com/blog/amkor-signs-pmt-with-u-s-dept-of-commerce-for-arizona-advanced-packaging-and-test-facility/#:~:text=Amkor%20announced%20in%20November%202023,people%20at%20the%20new%20facility.) In November 2023, Resonac, a Japan-based chip materials maker, announced plans to set up a research and development center for advanced semiconductor packaging and materials in Silicon Valley (Source: https://www.resonac.com/news/2023/11/22/2786.html) In June 2023, Intel's $4.6 billion investment in a new semiconductor assembly and test facility in Poland will boost the Advanced Semiconductor Packaging Market. This expansion, part of Intel's broader European efforts, strengthens the region's semiconductor supply chain and addresses growing demand for assembly and test capacity. (Source: https://www.intel.com/content/www/us/en/newsroom/news/intel-plans-assembly-test-facility-poland.html)

Top Companies Market Share in Advanced Semiconductor Packaging Industry: (In no particular order of Rank)

• Advanced Micro Devices
• Inc.
• Intel Corporation
• Amkor Technology
• STMicroelectronics
• Hitachi
• Ltd.
• Infineon Technologies AG
• Avery Dennison Corporation
• Sumitomo Chemical Co.
• Ltd.
• ASE Technology Holding Co.
• Ltd.
• KYOCERA Corporation
• Confidential Data
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• Data Hidden

*List of Second Tier Companies, List of Third Tier/ Start-up Companies (Inquire with sales executive) Request Any Company Profile for Preview Purpose OR Data Validation!

If any Company(ies) of your interest has/have not been disclosed in the above list then please let us know the same so that we will check the data availability in our database and provide you the confirmation or include it in the final deliverables.

Regional Analysis of the Advanced Semiconductor Packaging Market

Which Region Dominates the Advanced Semiconductor Packaging Market in 2024?

According to Cognitive Market Research, The Asia-Pacific region is the dominant force in the advanced semiconductor packaging market. With its robust electronics manufacturing infrastructure, the region benefits from significant investments in technology and innovation. Major semiconductor companies have established production facilities and R&D centers in countries such as China, South Korea, and Taiwan, contributing to Asia-Pacific’s leading market share. The presence of key players and a strong supply chain network enhances the region's position. Furthermore, rising consumer electronics demand and government initiatives to bolster the semiconductor industry further reinforce Asia-Pacific's leading role in the global market.

Which Region is Expanding at the Fastest CAGR?

The Asia Pacific region is experiencing the fastest growth rate in the advanced semiconductor packaging market. Increased investments in technology and infrastructure development are driving this rapid expansion. Governments in the region are implementing policies to attract foreign investment and promote local manufacturing capabilities. The growing adoption of electronic devices and advancements in telecommunications are fueling demand for advanced packaging solutions. Additionally, the expansion of key players into Asia Pacific is enhancing market dynamics and accelerating growth. These factors collectively contribute to the region's impressive compound annual growth rate (CAGR) within the advanced semiconductor packaging sector.

The current report Scope analyzes Advanced Semiconductor Packaging Market on 5 major region Split (In case you wish to acquire a specific region edition (more granular data) or any country Edition data then please write us on info@cognitivemarketresearch.com

• North America (United States, Canada, Mexico)
• Europe (United Kingdom, France, Germany, Italy, Russia, Spain, Sweden, Denmark, Netherlands, Switzerland, Belgium)
• Asia-Pacific (China, Japan, Korea, India, Australia, Philippines, Singapore, Malaysia, Thailand, Indonesia, Rest of APAC)
• South America (Brazil, Argentina, Colombia, Peru, Chile, Rest of South America)
• Middle East and Africa (Saudi Arabia, Turkey, Nigeria, UAE, Egypt, South Africa, GCC Countries, Rest of MEA)

The above graph is for illustrative purposes only.

North America Advanced Semiconductor Packaging Market

According to Cognitive Market Research, the global Advanced Semiconductor Packaging Market size was estimated at USD 30221.5 Million, out of which North America held the major market share of more than 40% of the global revenue with a market size of USD 12088.60 million in 2024 and will grow at a compound annual growth rate (CAGR) of 3.7% from 2024 to 2031.

• According to Cognitive Market Research, the US had a major share in the Advanced Semiconductor Packaging Market with a market size of USD 9537.91 million in 2024 and is projected to grow at a CAGR of 3.5% during the forecast period. Growth was driven by high demand for advanced semiconductor technologies in AI, 5G, and defense sectors.
• The Canada Advanced Semiconductor Packaging Market had a market share of USD 1450.63 million in 2024 and is projected to grow at a CAGR of 4.5% during the forecast period. Increasing adoption of advanced electronics in automotive and telecommunications boosts market growth.
• The Mexico Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.2% during the forecast period, with a market size of USD 1100.06 million in 2024.

Europe Advanced Semiconductor Packaging Market

According to Cognitive Market Research, the global Advanced Semiconductor Packaging Market size was estimated at USD 30221.5 Million, out of which Europe held the market share of more than 30% of the global revenue with a market size of USD 9066.45 million in 2024 and will grow at a compound annual growth rate (CAGR) of 4.0% from 2024 to 2031.

• The United Kingdom Advanced Semiconductor Packaging Market had a market share of USD 1523.16 million in 2024 and is projected to grow at a CAGR of 4.8% during the forecast period. The push towards digital transformation and investments in AI and autonomous driving fuel market demand.
• The France Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 3.2% during the forecast period, with a market size of USD 834.11 million in 2024.
• According to Cognitive Market Research, the German Advanced Semiconductor Packaging Market size was valued at USD 1795.16 million in 2024 and is projected to grow at a CAGR of 4.2% during the forecast period. Growth powered by the automotive industry's shift towards electric vehicles and autonomous technologies.
• The Italy Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 3.4% during the forecast period, with a market size of USD 779.71 million in 2024.
• The Russia Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 3.0% during the forecast period, with a market size of USD 1405.30 million in 2024.
• The Spain Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 3.1% during the forecast period with a market size of USD 743.45 million in 2024
• The Luxembourg Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.1% during the forecast period, with a market size of USD 281.06 million in 2024.
• The Portugal Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 3.8% during the forecast period, with a market size of USD 190.40 million in 2024.
• The Greece Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.3% during the forecast period, with a market size of USD 108.80 million in 2024.
• The Rest of Europe's Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 2.7% during the forecast period, with a market size of USD 1405.30 million in 2024.

Asia Pacific Advanced Semiconductor Packaging Market

According to Cognitive Market Research, the global Advanced Semiconductor Packaging Market size was estimated at USD 30221.5 Million, out of which Asia Pacific held the market share of around 23% of the global revenue with a market size of USD 6950.95 million in 2024 and will grow at a compound annual growth rate (CAGR) of 7.5% from 2024 to 2031.

• According to Cognitive Market Research, the China Advanced Semiconductor Packaging Market size was valued at USD 3127.93 million in 2024 and is projected to grow at a CAGR of 7.0% during the forecast period. Dominance in semiconductor manufacturing and expansion of 5G infrastructure drive market growth.
• The Japan Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 6.0% during the forecast period, with a market size of USD 959.23 million in 2024.
• The India Advanced Semiconductor Packaging Market had a market share of USD 834.11 million in 2024 and is projected to grow at a CAGR of 9.9% during the forecast period. Rising demand for consumer electronics and investments in semiconductor manufacturing spur growth.
• The South Korean Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 6.6% during the forecast period, with a market size of USD 695.09 million in 2024.
• The Australian Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 7.2% during the forecast period, with a market size of USD 361.45 million in 2024.
• The South East Asia Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 8.5% during the forecast period, with a market size of USD 479.62 million in 2024.
• The Rest of Asia Pacific Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 7.3% during the forecast period, with a market size of USD 493.52 million in 2024.

South America Advanced Semiconductor Packaging Market

According to Cognitive Market Research, the global Advanced Semiconductor Packaging Market size was estimated at USD 30221.5 Million, out of which the Latin America held the market share of around 5% of the global revenue with a market size of USD 1511.08 million in 2024 and will grow at a compound annual growth rate (CAGR) of 4.9% from 2024 to 2031.

• According to Cognitive Market Research, the Brazil Advanced Semiconductor Packaging Market size was valued at USD 646.74 million in 2024 and is projected to grow at a CAGR of 5.5% during the forecast period. Expanding telecommunications infrastructure and increasing demand for connected devices support growth.
• Argentina's Advanced Semiconductor Packaging Market had a market share of USD 253.86 million in 2024 and is projected to grow at a CAGR of 5.8% during the forecast period. Growth is fueled by rising investments in telecommunications and consumer electronics sectors.
• Colombia Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.7% during the forecast period, with a market size of USD 134.49 million in 2024.
• Peru Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 5.1% during the forecast period, with a market size of USD 123.91 million in 2024.
• Chile Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 5.2% during the forecast period, with a market size of USD 108.80 million in 2024.
• The Rest of Latin America's Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.0% during the forecast period, with a market size of USD 243.28 million in 2024.

Middle East and Africa Advanced Semiconductor Packaging Market

According to Cognitive Market Research, the global Advanced Semiconductor Packaging Market size was estimated at USD 30221.5 Million, out of which the Middle East and Africa held the major market share of around 2% of the global revenue with a market size of USD 604.43 million in 2024 and will grow at a compound annual growth rate (CAGR) of 5.2% from 2024 to 2031..

• The GCC Countries Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 6.0% during the forecast period, with a market size of USD 258.70 million in 2024. Investments in smart cities and digital infrastructure are key drivers of market expansion.
• The Egypt Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 5.5% during the forecast period, with a market size of USD 63.47 million in 2024.
• The South Africa Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 6.2% during the forecast period, with a market size of USD 95.50 million in 2024. Growth is driven by increasing telecommunications investments and the development of digital infrastructure.
• The Turkey Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.7% during the forecast period, with a market size of USD 51.98 million in 2024.
• The Nigeria Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.3% during the forecast period, with a market size of USD 63.47 million in 2024.
• The Rest of the MEA Advanced Semiconductor Packaging Market is projected to witness growth at a CAGR of 4.2% during the forecast period, with a market size of USD 71.32 million in 2024.

Advanced Semiconductor Packaging Market Analysis

Advanced Semiconductor Packaging Market Packaging Type Segment Analysis

According to Cognitive Market Research, Fan-out Wafer-Level Packaging (FOWLP) stands as the dominant segment in the advanced semiconductor packaging market. This technology facilitates a high density of interconnections and superior electrical performance by embedding chips in a reconstituted wafer. The expansion of FOWLP is driven by its ability to address the miniaturization demands of modern electronics, offering enhanced thermal dissipation and reduced package size. Its prominent role in consumer electronics, such as smartphones and tablets, underscores its criticality. The capability to integrate multiple chips in a single package without compromising performance makes FOWLP indispensable for high-performance applications, cementing its position as the market leader.

The 2.5D/3D packaging segment is experiencing rapid growth due to its transformative impact on semiconductor technology. These packaging solutions enable vertical stacking of chips or integration of multiple chips with an interposer, leading to significant improvements in performance and efficiency. The rise of advanced applications, including high-performance computing and artificial intelligence, drives the demand for 2.5D/3D packaging solutions. Their ability to offer high bandwidth, reduced latency, and compact form factors aligns with the evolving needs of cutting-edge technologies. The surge in demand from sectors like data centers and AI applications propels 2.5D/3D packaging as the fastest-growing segment in the market.

The above Chart is for representative purposes and does not depict actual sale statistics. Access/Request the quantitative data to understand the trends and dominating segment of Advanced Semiconductor Packaging Industry. Request a Free Sample PDF!

Advanced Semiconductor Packaging Market Application Segment Analysis

According to Cognitive Market Research, the Central Processing Units (CPUs) and Graphical Processing Units (GPUs) represent the largest application segment in the advanced semiconductor packaging market. CPUs, pivotal for general computing tasks, and GPUs, crucial for high-performance graphics processing, are integral to a broad spectrum of digital devices, including personal computers, servers, and gaming consoles. The relentless pursuit of enhanced processing power and energy efficiency in consumer electronics and enterprise systems drives demand for advanced packaging solutions. The evolving needs for high-speed data processing and greater computational capability in both consumer and industrial applications underpin the dominance of this segment, making it a cornerstone of the semiconductor packaging landscape.

The image sensor segment is experiencing the most rapid growth within the advanced semiconductor packaging market. The proliferation of imaging technologies in smartphones, automotive systems, and medical devices propels this expansion. Image sensors, essential for converting optical images into electronic signals, are increasingly integral to applications requiring high-resolution and precise imaging, such as advanced driver assistance systems (ADAS) and medical imaging equipment. Technological advancements in sensor capabilities and miniaturization, coupled with a surge in demand for enhanced imaging in various sectors, are driving this segment's accelerated growth. The emphasis on innovation and improved performance in imaging applications underscores the dynamic expansion of this sector.

The above Graph is for representation purposes only. This chart does not depict actual Market share.

Advanced Semiconductor Packaging End-user Segment Analysis

Advanced Semiconductor Packaging Market End-user Segment Analysis

According to Cognitive Market Research, Telecommunications is the largest end-user segment in the advanced semiconductor packaging market. This sector drives significant demand due to the essential role of semiconductor packaging in high-speed data transmission and connectivity. The relentless evolution of communication networks, including the expansion of 5G technology and infrastructure, fuels this segment's growth. Advanced packaging solutions enhance the performance and reliability of telecommunications equipment, supporting the increasing need for efficient data handling and signal processing. The substantial investments in network upgrades and the proliferation of connected devices underscore the sector's dominance, ensuring its leading position in the market.

Automotive is the fastest-growing end-user segment in the advanced semiconductor packaging market. The automotive industry is experiencing a paradigm shift with the rise of autonomous driving technologies, electric vehicles, and advanced driver assistance systems (ADAS). These innovations necessitate advanced semiconductor solutions that offer high performance and reliability in harsh operating environments. The integration of sophisticated electronics into vehicles for improved safety, connectivity, and energy efficiency accelerates demand for advanced packaging solutions. As automotive technology evolves rapidly, the need for cutting-edge semiconductor packaging solutions grows exponentially, positioning this segment as the most dynamic in the market.

• Telecommunications
• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics
• Others

Author's Detail

Kalyani Raje

Senior Research Analyst at Cognitive Market Research

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An optimistic Senior Research Analyst with years of experience in competitive assessment and business consulting. A seasoned professional and subject-matter expert (SME) in the Automobile and transportation vertical.

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